Discovery

Researchers at Rensselaer Polytechnic Institute and Polyset Company have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.

Worked with new materials called polyset epoxy siloxane (PES), the researchers were managed to create a new generation of lower-cost, on-chip nanoimprinting lithography technology. “Chip manufacturers will be able to trim several steps from their production and packaging processes, and in turn realize a cost savings”, said Toh-Ming Lu, the R.P. Baker Distinguished Professor of Physics at Rensselaer to ScienceDaily.

Adapted from materials provided by Rensselaer Polytechnic Institute and enriched by ScienceDaily.