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Researchers from Clemson University have developed a new process and equipment that will lead to a significant reduction in heat generated by silicon chips or microprocessors while speeding up the rate at which information is sent.
Rajendra Singh, D. Houser Banks Professor and director for the Center for Silicon Nanoelectronics said that, hopefully, the next generation of laptops, desk computers, cell phones and other semiconductor devices may get faster and more cost-effective.
Microprocessor performs the logic functions of many high technology products. As it is known, during its function, the processor produce heat depending on the speed at which the microprocessor operates. Singh said, they work on improvement of the performance of the materials to produce less power lost through leakage.
The patented technique has the potential to improve the performance and lower the cost of next-generation computer chips and a number of semiconductor devices, which include green energy conversion devices such as solar cells.
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